全自动晶圆Wafer检查机 SVII-H6 Automatic Wafer Inspection Machine SV II -H6

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产品型号 Product Model SVII-H6
检测用途 (Application) 钢网来料检测或清洗后检测 (Stencil incoming inspection or inspection after cleaning)
测量项目 (Inspection Items) 开孔面积、位置、偏移、尺寸、异物、毛刺、堵孔、多孔、少孔、张力、宽厚比、
面积比、孔间距、模拟下锡量
(aperture area, position, shift, size, foreign body, glitch, hole blocking, multi hole, miss hole, tension meter, width-to-thickness ratio, area ratio, pitch of holes, simulating the amount of solder paste
相机 (Camera) 标配 (Options): carmera 1200万 (12M) 选配 (Options): carmera 2500万 (25M)
光学分辨率 (Optical Resolution) 3.45 μm 2.74 μm
每FOV时间 (Inspection Time per FOV) 1200万:0.6S/FOV 2500万:0.7S/FOV
最大测量开孔尺寸 (Max Size for Apertures) 12.19 mm × 8.38 mm 12.60 mm × 10.60 mm
最小测量开孔尺寸 (Min Size for Apertures) 40 μm 30 μm
最小测量开孔间距 (Min distance between apertures) 50 μm 40 μm
FOV 14.19mm×10.38mm 14.60mm×12.60mm
分辨率(亚像素)(resolving power Subpixel) 0.21μm 0.17μm
尺寸重复精度 (Dimensional Repeatability) 1个像素(Pixels)
运控精度 (Motion Control Accuracy) 重复精度(Repeatability):±1μm 定位精度(Location):±2μm
开孔检测GRR(Opening detection GRR) Gage R&R<5%
检测开孔数 (Number of Test Holes) ≤100万 (≤1000 thousands)
镜头 (camera lens) 远心镜头(Double telecentric lens)
光源 (Lighting) 顶部:红色同轴光 ;底部:定制白色LED光源
(Top: Red coaxial light; Bottom: custom white LED light source)
网框尺寸 (Stencil Size) (736mm x 800mm) Max (200mm x 200mm) Min
检测范围 (Inspection Area) 500 × 550 mm
Gerber File RS-274X format (Gerber data teaching)
SPC Histogram, Xbar-R Chart,Xbar-s Chart,Cp&Cpk, Daily/Weekly/Monthly Report
远程维护 (Remote Maintenance) TeamViewer software /Anydesk or Sunlogin software
离线编程 (Offline Programming) 离线程序查看 (Offline programming checking)
计算机系统 (Computer System) Windows 10 专业版 64 位 (Windows 10 Professional Edition 64 bit)
计算机 (Computer) DELL 工作站 (Dell workstation)
电源 (Power Requirement) 220V,50/60HZ,功率(Power):2kW
设备尺寸 (Equipment Size) 1260 mm (L) × 1310 mm (W) × 1600 mm (H) 不含三色灯 (Does not contain three-color light)
气源 (Air Supply) 0.2 MPa – 0.6 MPa
设备重量 (Equipment Weight) 1350 kg
选配项 (Options) 钢网信息管理系统(SIMS) (Stencil information management system)
定制开发MES模板 (Customized development of MES template)
刮刀直线度检测 (Squeegee parellenlism test)
Gerber文件设计与比对 (Gerber files design and contrast)
PCB焊盘检测 (PCB pad inspection)
钢网厚度检测(thickness inspection)

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