产品型号 (Product Model) | SVII-T200 |
检测用途 (Application) | 陶瓷料、铁氧体、LTCC、MOM等微孔检测 (Micro aperture inspection for ceramic, ferrite, LTCC, and MOM) |
测量项目 (Inspection Items) | 圆度、饱满度、粉尘、面积、位置、偏移、尺寸、异物、毛刺、堵孔、少孔 (Roundness, fullness, dust, area, position, offset, size, foreign objects, burr, hole clogging, missing hole, extra hole) |
每FOV时间 (Inspection time per FOV) | 0.4S/FOV |
开孔面积测量精度 (Measurement accuracy of aperture area) | Gage R&R < 5.0% |
开孔位置测量精度 (Measurement accuracy of aperture position) | ±1.5 μm |
检测开孔数 (Max. apertures for inspection) | ≤100万 (1,000,000) |
镜头 (Camera Lens) | 远心镜头 (Telecentric Lens) |
照明 (Lighting) | 特殊定制白色光源&环形光源 (Special custom white light source & ring light source) |
相机 (Camera) | 2500万 (25 million) |
相机分辨率 (Camera Resolution) | 3.1 μm |
FOV | 16 mm × 16 mm |
最小检测开孔尺寸 (Minimum Detection Opening Size) | 30 μm |
最小检测开孔间距 (Minimum Detection Opening Spacing) | 200 μm |
尺寸 (Size) | 6/8寸 280 mm × 350 mm |
上料方式 (Feeding Mode) | 手工上料 (Manual Feeding) |
SPC | Histogram, XBar-R Chart, XBar-S Chart, Cp & Cpk, Daily/Weekly/Monthly Reports |
远程维护 (Remote Maintenance) | TeamViewer / Anydesk / 向日葵 |
离线编程 (Offline Programming) | 离线编程查看 (Offline Programming View) |
品牌 (Brand) | 戴尔图形工作站 (Dell Graphics Workstation) |
系统 (System) | Windows10 专业版64位 (Windows10 Professional 64 bit) |
电源要求 (Power Requirements) | 220V, 50/60Hz 功率: 2000W |
设备尺寸 (Equipment Size) | 910 mm × 1122 mm × 1430 mm (长*宽*高)不含三色灯/显示器 |
气源 (Gas Source) | 0.4 MPa – 0.6 MPa |
设备重量 (Equipment Weight) | 900 KG |

全自动陶瓷模检查机SV II -T200mini Automatic Ceramic Film Inspection Machine SVII-T200mini
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