全自动陶瓷膜检查机SV II -T200 Automatic Ceramic Film Inspection Machine SVII-T200

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产品型号 (Product Model) SVII-T200
检测用途 (Application) 陶瓷料、铁氧体、LTCC、MOM等微孔检测
(Micro aperture inspection for ceramic, ferrite, LTCC, and MOM)
测量项目 (Inspection Items) 圆度、饱满度、粉尘、面积、位置、偏移、尺寸、异物、毛刺、堵孔、少孔
(Roundness, fullness, dust, area, position, offset, size, foreign objects, burr, hole clogging, missing hole, extra hole)
每FOV时间 (Inspection time per FOV) 0.35S/FOV
开孔面积测量精度 (Measurement accuracy of aperture area) Gage R&R < 3%
开孔位置测量精度 (Measurement accuracy of aperture position) ±3 μm
检测开孔数 (Max. apertures for inspection) ≤100万 (≤1 million)
传动机构 (Transmission mechanism) 重复性±2µm 伺服系统(分辨率0.1 µm) (Repeatability ±2µm Servo system ,Resolution 0.1 µm)
上/下料方式 (Loading/Unloading) 自动上、下料 (Auto)
除尘 (Dust Exhausting) 自动吸尘(Auto)
相机 (Camera) AVT carmera 2500万(25M)
镜头 (Lens) 双远心镜头 (Dual Telecentric)
照明 (Lighting) 特殊白色LED光源 (Special white LED light)
相机分辨率 (Carmera Resolution) 3 μm
最大测量开孔尺寸 (Max. Size for Apertures) 13mm x 13mm
最小测量开孔尺寸 (Min. Size for Apertures) 30 μm
最小测量开孔间距 (Min. Distance Between Apertures) 60 μm
FOV 15mm x 15mm
产品尺寸 (Product Size) 小于600mm x 830mm (6寸,8寸,10寸) (less then 600mm x 830mm,6inch,8inch, 10inch)
检测范围 (Inspection Area) 600mm x 830mm
Gerber File CAD, RS-274-X format(Gerberdata te te aching)
SPC Histogram, XBar-R Chart, XBar-S Chart, Cp & Cpk, Daily/Weekly/Monthly Reports
远程维护 (Remote Maintenance) TeamViewer software or Anydest
数据交互 (Data interaction) 支持与MES数据交互 (Data interaction with MES)
离线编程 (Offline Programming) 离线编程查看 (Offline Programming Checking)
计算机 (Computer) 研华工控机 (Advantech Industrial Personal Computer)
计算机系统 (Computer System) Windows 10 专业版64位 (Windows 10 Professional 64 bit)
电源要求 (Power Requirements) 220V, 50/60Hz 功耗(Power): 4000W
设备尺寸 (Equipment Size) 4300 mm(L) × 1800 mm(W) × 1760 mm(H) 不含三色灯 (Does not contain three-color light)
气源 (Air Supply) 0.4 MPa – 0.6 MPa
设备重量 (Equipment Weight) 3380 KG

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