产品型号 (Product Model) | SVII-T200 |
检测用途 (Application) | 陶瓷料、铁氧体、LTCC、MOM等微孔检测 (Micro aperture inspection for ceramic, ferrite, LTCC, and MOM) |
测量项目 (Inspection Items) | 圆度、饱满度、粉尘、面积、位置、偏移、尺寸、异物、毛刺、堵孔、少孔 (Roundness, fullness, dust, area, position, offset, size, foreign objects, burr, hole clogging, missing hole, extra hole) |
每FOV时间 (Inspection time per FOV) | 0.35S/FOV |
开孔面积测量精度 (Measurement accuracy of aperture area) | Gage R&R < 3% |
开孔位置测量精度 (Measurement accuracy of aperture position) | ±3 μm |
检测开孔数 (Max. apertures for inspection) | ≤100万 (≤1 million) |
传动机构 (Transmission mechanism) | 重复性±2µm 伺服系统(分辨率0.1 µm) (Repeatability ±2µm Servo system ,Resolution 0.1 µm) |
上/下料方式 (Loading/Unloading) | 自动上、下料 (Auto) |
除尘 (Dust Exhausting) | 自动吸尘(Auto) |
相机 (Camera) | AVT carmera 2500万(25M) |
镜头 (Lens) | 双远心镜头 (Dual Telecentric) |
照明 (Lighting) | 特殊白色LED光源 (Special white LED light) |
相机分辨率 (Carmera Resolution) | 3 μm |
最大测量开孔尺寸 (Max. Size for Apertures) | 13mm x 13mm |
最小测量开孔尺寸 (Min. Size for Apertures) | 30 μm |
最小测量开孔间距 (Min. Distance Between Apertures) | 60 μm |
FOV | 15mm x 15mm |
产品尺寸 (Product Size) | 小于600mm x 830mm (6寸,8寸,10寸) (less then 600mm x 830mm,6inch,8inch, 10inch) |
检测范围 (Inspection Area) | 600mm x 830mm |
Gerber File | CAD, RS-274-X format(Gerberdata te te aching) |
SPC | Histogram, XBar-R Chart, XBar-S Chart, Cp & Cpk, Daily/Weekly/Monthly Reports |
远程维护 (Remote Maintenance) | TeamViewer software or Anydest |
数据交互 (Data interaction) | 支持与MES数据交互 (Data interaction with MES) |
离线编程 (Offline Programming) | 离线编程查看 (Offline Programming Checking) |
计算机 (Computer) | 研华工控机 (Advantech Industrial Personal Computer) |
计算机系统 (Computer System) | Windows 10 专业版64位 (Windows 10 Professional 64 bit) |
电源要求 (Power Requirements) | 220V, 50/60Hz 功耗(Power): 4000W |
设备尺寸 (Equipment Size) | 4300 mm(L) × 1800 mm(W) × 1760 mm(H) 不含三色灯 (Does not contain three-color light) |
气源 (Air Supply) | 0.4 MPa – 0.6 MPa |
设备重量 (Equipment Weight) | 3380 KG |

全自动陶瓷膜检查机SV II -T200 Automatic Ceramic Film Inspection Machine SVII-T200
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