整體參數 |
Parameters |
|
外形尺寸 |
Dimension L×W×H |
2600×1800×1600mm (1-2缸pot) |
傳輸系統 |
Transporting System |
|
PCB寬度 |
PCB Width |
60-450mm |
PCB長度 |
PCB Length |
120-500mm |
PCB顶部空間 |
PCB Top Space |
Max: 120mm |
PCB底部空間 |
PCB Bottom Space |
Max: 50mm |
PCB工艺边尺寸 |
PCB Edge Size |
4mm |
PCB運輸高度 |
Conveyor Height |
900±20 |
PCB運輸速度 |
Conveying Speed |
0.2-10m/min |
PCB重量 |
PCB Weight |
Max: 5kg |
助焊劑模块 |
Fluxer Module |
|
助焊劑儲存罐 |
Flux Capacity |
2L |
噴霧噴頭管大小 |
The Size of Flux Nozzle Tube |
130um |
喷塗寬度 |
Flux Width |
2-8mm |
预熱模块 |
Preheating Module |
|
底部動態红外發熱器 |
Bottom Movable Infrared Heater |
Max: 14kw |
溫度範圍 |
Temperature Range |
室溫 Room Temperature ~250°C |
顶部熱風加熱器 |
Top Air Heater |
Max: 6kw |
焊接模塊 |
Soldering Module |
|
最小喷嘴直徑 |
Min Diameter of Solder Nozzle |
¢2/4.5 |
波峰高度 |
Wave Height |
3~5mm |
錫爐容量 |
Solder Pot Capacity |
8KG |
焊接溫度 |
Soldering Temperature |
Max: 350°C |
加熱時間 |
Heating Time |
40min/(300°C) |
錫爐加熱功率 |
Pot Heating Power |
1KW/單缸 Single pot |
定位速度 |
Location Speed |
X/Y: 2-200mm/s |
控溫精度 |
Temp. Control Accuracy |
±2°C |
焊接精度 |
Soldering Accuracy |
±0.25mm |
控制系統 |
Control System |
|
PC操作系統 |
PC Operating System |
Windows 10 |
遠程可視化 |
Process Visualization |
CCD 可視 Visual |
軟件語言 |
Software Language |
中英文可切換 Chinese and English Changeable |
編程方式 |
Programming Mode |
在線/離線編程 Inline/Offline Programming |
數據導入 |
Data Import |
Gerber、圖像導入 Image Introduction |
氣源系統 |
Air System |
|
氣體供應 |
Air Supply |
氮氣/空氣 N2/O2 |
所需壓力 |
Required Pressure |
0.4-0.8Mpa |
氮氣消耗量 |
N2 Consumption |
每個錫缸消耗約 Each consumes about 1.5-2 m³/h |
N2濃度 |
N2 Concentration |
≥ 99.999% |
電氣參數 |
Electrical Parameter |
|
電源 |
Power Supply |
AC 380VAC 3Φ5W 50/60Hz |
總功率 |
Consumption |
35KW |
機器排風 |
Air Exhaust |
|
排風管直徑 |
Air Duct Diameter |
¢150mm |
排風管排風量 |
Exhaust Air Rate |
360m³/h |
備註: 參數若有更改,恕不另行通知! The above contents are subject to change without further notice! |
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