Saki 3-Xi-M110

Saki 3Xi-M110

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Description
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System Specifications
Model	3Xi-M110
Resolution	10μm-30μm
PCB Size	50 (W) x 120 (L) mm – 360x330mm
PCB Thickness	0.8mm – 4.0mm (0.031-0.157 in.)
PCB Warpage	2mm (0.08 in.) or less
PCB Clearance	TOP : 60mm (2.36 in.) Bottom : 40mm (1.57in.)
Inspection Categories	Chin Type Parts, Diodes, Tantalum Capacitors, Module chips, Transistors, Power Transistors, Connectors, QFP, SOP, CSP, QFN, and BGA
Detector	Flat Panel 14bit 3M Pixel
X-ray Tube	110kV 30W, Closed X-ray Source
X-ray leakage	0.5μSvh or less
Conveyer Method	Flat belt transfer
Conveyer Height	880-920 mm (34.65-36.22 in.)
Width Adjustment	Auto Width Adjustment
Operating System	Window 10 IoT Enterprise 2019 EMB 64bit (Microsoft)

Installation Specifications
Electric Power Requirement	Three – Phase ~200 +/-10%, 50/60Hz
Power Consumption	4.2kVA
Air Requirement	0.5 MPa, 20 L/min(ANR)
Usage Environment	15°C – 28°C / 15 – 80%RH (Non-condensing)
Noise Level	70.0dB or less
Dimensions W x D x H (Main body)	1380 x 2150 x 1500 mm (*)
Weight (Main body)	Aprox. 3,100 kg (6834.34 lbs)
	(*)This is subject to change without notice.

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