Hardware / Function Specifications | |
Model Name | 2Di-LU1 |
Resolution | 18μm |
Target PCB Size mm (in.) | Carrier: 50 W x 60 L – 610 W x 610 L mm (1.97 W x 2.36 L – 24.02 W x 24.02 L in.) Inspection area (Scan): 50 W x 60 L – 460 W x 500 L mm (1.97 W x 2.36 L – 18.11 W x 19.69 L in.) |
PCB Thickness | 0.5 – 5.2 mm (0.02 – 0.20 in.) |
PCB Weight | 12 kg (26.46 lbs) or less |
PCB Clearance | Top: 130mm (5.12 in.), Bottom: 40mm (1.57 in.) |
Heat Resistant Temperature | 70°C (158F) or lower |
Inspection Categories | Solder inspection for THT (Copper, Blow Hole, Pin, Fillet, Absence of Solder, Bridge) *Each defect name can be arranged freely by the system function |
Transfer Conveyor Method | Flat belt transfer |
Transfer Conveyor Height | 880 – 965 mm (34.65 – 37.99 in.) |
Operating System | Windows 10 IoT Enterprise 64 bit English Edition (Microsoft) |
Electric Power Requirement | ~ 200 – 240V+/-10%, 50/60Hz, 700VA |
Air Requirement | 0.5MPa, 5L/min (ANR) |
Usage Environment | 15°C(59F) – 30°C (86F) / 15 – 80% RH (Non-condensing) |
Dimensions W x D x H (Main body) | 1040 x 1440 x 1500 mm (40.94 x 56.69 x 59.06 in.) |
Weight | Approx. 750 kg, 1653.47 lbs |

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